Job Requirement
1. Knowledge of semiconductor package and test related process.
半导体封装、测试相关制程的了解。
2.Good English writing and communication skills.
具备良好的英语写作、沟通能力。
3.Good cross-functional coordination and communication skills with customers
具备良好的跨部门协调及与客户沟通的技巧
Job Description
1. Familiar with QC tools FMEA, SPC, PPAP and other quality methods.
熟悉QC工具FMEA、SPC、PPAP等品质方法。
2.Handled customer complaints and 8D techniques to solve problems.
处理客户投诉、8D手法解决问题。
3.Assisted the client in the production line audit and tracked the improvement results.
协助客户进产线稽核,并追踪改善结果。